Automatic Continuous Copper Busbar Silver Plating Machine
Main technical data
| MODEL | OCSP300 |
| Copper busbar width range | 20-300 mm |
| Copper busbar length range | ≥3000mm |
| Copper busbar thickness range | 3-20mm |
| Silver layer thickness range | 0-0.5 um, adjustment |
| Production speed | 5-18 m /min, adjustment (calculate as 5*50 mm busbar, plating with 0.1 µm, around 1-3 T/h) |
| Total installing power | ≈130 kW (include filter and rectifier) |
| Actual running power | ≈50-80 kW (include filter and rectifier) |
| Dimension | 39*2.0*2.2 m |
Advantages
● The line changes the way of traditional hanging plating to conventional way, which improves the efficiency, surface quality and performance of the plating corrosion resistance.
● Small floor space, low flux consumption, environment friendly, and advanced production process, etc.
● The cleaning and plating section are all automatic running, only needs feeding and packing manpower for the line.
● The line also could be equipped with feeding and offloading mechanical arm which can matched with the hydraulic drawing machine.
● This line works in a closed condition and trough stepless speed regulation microcomputer to control, the busbar gets continuously silver plated under high density of current.
● The waste air treatment ratio is more than 98% and waste water treatment ratio is 100%.
● Multi pieces busbars can be plated synchronously when busbar width is less than 150 mm.
Brief process flow
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Main technical data MODEL OCTP300 Copper busbar width range 20-150 mm*2 Copper busbar length range ≥4000mm Copper busbar thickness range 3-20mm Tinning layer thickness range 0-3 um, adjustment Production speed 5-20 m /min, adjustment (calculate as 6*60 mm busbar, plating with 1-3µm, around 1-3T/h) Total installing power ≈100 kW (include filter and rectifier) Actual runn...